Oct 28, 2026
Join Us at PU China 2026 in Shanghai!
 
This November, the global polyurethane community gathers in Shanghai for the 22nd China International Polyurethane Exhibition (PU China 2026), taking place November 3–5 at the Shanghai World Expo Exhibition & Convention Center.

Wynca, together with its subsidiaries Hangzhou Topwin Technology Develpment Co.,ltd  and Fujian Wynca Technology Co.,ltd, sincerely invites you to visit our booth , where we'll be showcasing our latest solutions and exploring new pathways toward green innovation and sustainable development in the polyurethane industry.

We look forward to welcoming you in Shanghai!

Exhibition Dates: November 3–5, 2026
Venue: Hall 1, Shanghai World Expo Exhibition & Convention Center
Booth No.: H1-1630
Main products:

WynPUF® SILICONE SURFACTANTS FOR RIGID FOAM

WynPUF® SILICONE SURFACTANTS FOR FLEXIABLE FOAM

WynPUF® SILICONE SURFACTANTS FOR SHOE SOLE 

WynPUF® SILICONE SURFACTANTS FOR HIGH RESILIENCE MOULD FOAM

WynPUF® SILICONE SURFACTANTS FOR VISCOELASTIC  OAM

Star products:

Low-thermal-conductivity silicone surfactant XH-1641

Key Benefits:

  • Optimizes system flowability and enhances dimensional stability of the finished foam

  • Promotes uniform, fine cells to effectively lower thermal conductivity

 

Compression-Resistant Silicone Surfactant & Additives —XH-2596N+R150

Key Benefits:

  • Fast recovery

  • Uniform cell structure

  • Reduced density gradient in slabstock foam




Topwin is one of the leading professional manufacturers and solution providers with more than 20 years of experience, and has domestic top-level engineers in the silicone surfactant industry. Specializing in research and development, production, sales, and marketing of silicone-based special functional performance materials, Topwin also serves as a professional provider of technical services. Now our products are widely used in Polyurethane Foam, Corp Protection, Coatings and Inks, Leather & Textile, Release Coating for Paper & Film,Home & Personal Care, and others.